Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/27/2012
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Application #:
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11706822
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Filing Dt:
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02/13/2007
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Publication #:
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Pub Dt:
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08/14/2008
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Inventors:
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Chih-Ching Cheng, Chiung-Chi Tsai
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Title:
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METHOD FOR DICING A DICED OPTOELECTRONIC SEMICONDUCTOR WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 40, INDUSTRIAL 34TH RD. |
TAICHUNG, TAIWAN |
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THOMAS E. SISSON |
JACKSON WALKER, LLP |
112 E. PECAN, SUITE 2400 |
SA ANTONIO, TX 78205 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN |
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MUNCY, GEISSLER, OLDS & LOWE, P.C. |
4000 LEGATO RD., SUITE 310 |
FAIRFAX, VA 22033 |
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