Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/10/2012
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Application #:
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12534566
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Filing Dt:
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08/03/2009
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Inventors:
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Anand Chandrashekar, Raashina Humayun, Michal Danek
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Title:
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THINNING TUNGSTEN LAYER AFTER THROUGH SILICON VIA FILLING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3970 NORTH FIRST STREET |
| SAN JOSE, CALIFORNIA 95134 |
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| WEAVER AUSTIN VILLENEUVE & SAMPSON LLP |
| P.O. BOX 70250 |
| OAKLAND, CA 94612-0250 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3970 NORTH FIRST STREET |
| SAN JOSE, CALIFORNIA 95134 |
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| WEAVER AUSTIN VILLENEUVE & SAMPSON LLP |
| P.O. BOX 70250 |
| OAKLAND, CA 94612-0250 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3970 NORTH FIRST STREET |
| SAN JOSE, CALIFORNIA 95134 |
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| WEAVER AUSTIN VILLENEUVE & SAMPSON LLP |
| P.O. BOX 70250 |
| OAKLAND, CA 94612-0250 |
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