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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/10/2012
Application #:
12092160
Filing Dt:
04/30/2008
Publication #:
Pub Dt:
05/21/2009
Inventor:
Masayoshi Kondo
Title:
METHOD FOR FABRICATING MULTILAYER CIRCUIT BOARD, CIRCUIT PLATE, AND METHOD FOR FABRICATING THE CIRCUIT PLATE
Assignment: 1
Reel/Frame:
020879/0655Recorded: 04/30/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/22/2008
Assignee:
5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU
TOKYO, JAPAN 140-0002
Correspondent:
MASAYASU MORI
918 PRINCE STREET
ALEXANDRIA, VA 22314

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