Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/01/2012
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Application #:
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11915806
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Filing Dt:
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01/27/2009
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Publication #:
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Pub Dt:
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07/02/2009
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Inventors:
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Satoru Katsurayama, Yushi Sakamoto, Masaya Koda
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Title:
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ENCAPSULATING RESIN COMPOSITION FOR PREAPPLICATION, SEMICONDUCTOR DEVICE MADE WITH THE SAME, AND PROCESS FOR PRODUCING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5-8, HIGASHI-SHINAGAWA 2-CHOME |
SHINAGAWA-KU, TOKYO, JAPAN 140-0002 |
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ROBERT G. WEILACHER |
1230 PEACHTREE STREET |
SUITE 3100, PROMENADE II |
ATLANTA, GA 30309 |
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