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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/01/2012
Application #:
11915806
Filing Dt:
01/27/2009
Publication #:
Pub Dt:
07/02/2009
Inventors:
Satoru Katsurayama, Yushi Sakamoto, Masaya Koda
Title:
ENCAPSULATING RESIN COMPOSITION FOR PREAPPLICATION, SEMICONDUCTOR DEVICE MADE WITH THE SAME, AND PROCESS FOR PRODUCING THE SAME
Assignment: 1
Reel/Frame:
022159/0383Recorded: 01/27/2009Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/22/2008
Exec Dt:
01/22/2008
Exec Dt:
01/22/2008
Assignee:
5-8, HIGASHI-SHINAGAWA 2-CHOME
SHINAGAWA-KU, TOKYO, JAPAN 140-0002
Correspondent:
ROBERT G. WEILACHER
1230 PEACHTREE STREET
SUITE 3100, PROMENADE II
ATLANTA, GA 30309

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