Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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05/08/2012
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Application #:
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12359730
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Filing Dt:
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01/26/2009
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Publication #:
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Pub Dt:
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07/09/2009
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Inventors:
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Andreas JAKOB, Klaus-D VISSING, Volkmar STENZEL
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Title:
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METHOD AND DEVICE FOR MACHINING A WAFER, IN ADDITION TO A WAFER COMPRISING A SEPARATION LAYER AND A SUPPORT LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ELSTERSTRASSE 23 |
| EICHNAU, GERMANY 82223 |
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| ROYLANCE, ABRAMS, BERDO & GOODMAN, L.L.P |
| 1300 19TH STREET, N.W. |
| SUITE 600 |
| WASHINGTON, DC 20036 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME FROM THIN MATERIAL AG TO THIN MATERIALS AG PREVIOUSLY RECORDED ON REEL 024794 FRAME 0617. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.
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| ELSTERSTRASSE 23 |
| EICHNAU, GERMANY 82223 |
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| ROYLANCE, ABRAMS, BERDO & GOODMAN, L.L.P |
| 1300 19TH STREET, N.W. |
| SUITE 600 |
| WASHINGTON, DC 20036 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HANSASTRASSE 27C |
| MUNCHEN, GERMANY 80686 |
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| DUANE MORRIS LLP |
| 5100 TOWN CENTER CIRCLE |
| SUITE 650 |
| BOCA RATON, FL 33486 |
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Assignment:
4
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NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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| 7-1, KANDA-NISHIKI-CHO 3 CHOME, CHIYODA-KU |
| TOKYO, JAPAN 101-0054 |
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| DUANE MORRIS LLP |
| 5100 TOWN CENTER CIRCLE |
| SUITE 650 |
| BOCA RATON, FL 33486 |
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