Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/05/2012
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Application #:
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12646094
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Filing Dt:
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12/23/2009
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Publication #:
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Pub Dt:
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03/03/2011
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Inventors:
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HSIN-CHANG HSIUNG, CHIH-WEI TAN, PO-LIN SU
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Title:
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FABRICATING METHOD AND STRUCTURE OF A WAFER LEVEL MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.26, ZIH LIAN ROAD, FONGHUA VILLAGE |
| SINSHIH TOWNSHIP |
| TAINAN COUNTY, TAIWAN 74445 |
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| STOUT, UXA, BUYAN & MULLINS LLP |
| 4 VENTURE, SUITE 300 |
| IRVINE, CA 92618 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO.26, ZILIAN RD., XINSHI DIST. |
| TAINAN CITY, TAIWAN 74148 |
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| STOUT, UXA, BUYAN & MULLINS LLP |
| 4 VENTURE, SUITE 300 |
| IRVINE, CA 92618 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.26, ZIH LIAN ROAD, FONGHUA VILLAGE, XINSHI DIST. |
| TAINAN CITY, TAIWAN |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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