Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/05/2012
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Application #:
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12193835
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Filing Dt:
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08/19/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Inventors:
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Myeong-soon PARK, Hyun-soo CHUNG, Seok-ho KIM, Ki-hyuk KIM, Chang-woo SHIN
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Title:
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SEMICONDUCTOR PACKAGE AND MULTI-CHIP PACKAGE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| STANZIONE & KIM, LLP |
| 919 18TH ST., NW |
| SUITE 440 |
| WASHINGTON, DC 20006 |
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