Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/12/2012
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Application #:
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11728534
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Filing Dt:
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03/26/2007
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Publication #:
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Pub Dt:
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10/02/2008
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Inventors:
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Shanggar Periaman, Kooi Chi Ooi, Bok Eng Cheah, Yen Hsiang Chew
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Title:
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DIE BACKSIDE WIRE BOND TECHNOLOGY FOR SINGLE OR STACKED DIE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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CAVEN & AGHEVLI LLC |
C/O CPA GLOBAL |
PO BOX 52050 |
MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95052 |
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RAMIN AGHEVLI |
2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CA 95052 |
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