Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/26/2012
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Application #:
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13010478
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Filing Dt:
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01/20/2011
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Publication #:
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Pub Dt:
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07/21/2011
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Inventors:
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Bai-Yao LOU, Tsang-Yu Liu, Long-Sheng Yeou
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Title:
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CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
TAOYUAN COUNTY |
JHONGLI CITY, TAIWAN 32062 |
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WEN LIU |
444 S. FLOWER STREET, SUITE 1750 |
LOS ANGELES, CA 90071 |
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