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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/03/2012
Application #:
12285568
Filing Dt:
10/08/2008
Publication #:
Pub Dt:
04/30/2009
Inventors:
Yong Woo Hong, Ki Seong Jung, Wan Jung Kim, Chang Beom Chung, Su Mi Im, Sang Jin Kim
Title:
ADHESIVE FILM COMPOSITION, ASSOCIATED DICING DIE BONDING FILM, DIE PACKAGE, AND ASSOCIATED METHODS
Assignment: 1
Reel/Frame:
022080/0477Recorded: 01/05/2009Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/17/2008
Exec Dt:
11/17/2008
Exec Dt:
11/17/2008
Exec Dt:
11/17/2008
Exec Dt:
11/17/2008
Exec Dt:
11/17/2008
Assignee:
290, GONGDAN 2-DONG, GUMI-SI
GYEONGSANGBUK-DO, KOREA, REPUBLIC OF
Correspondent:
EUGENE M. LEE
LEE & MORSE, P.C.
3141 FAIRVIEW PARK DRIVE, SUITE 500
FALLS CHURCH, VA 22042

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