Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/03/2012
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Application #:
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12285568
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Filing Dt:
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10/08/2008
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Publication #:
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Pub Dt:
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04/30/2009
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Inventors:
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Yong Woo Hong, Ki Seong Jung, Wan Jung Kim, Su Mi Im, Sang Jin Kim, Chang Beom Chung
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Title:
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ADHESIVE FILM COMPOSITION, ASSOCIATED DICING DIE BONDING FILM, DIE PACKAGE, AND ASSOCIATED METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 290, GONGDAN 2-DONG, GUMI-SI |
| GYEONGSANGBUK-DO, KOREA, REPUBLIC OF |
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| EUGENE M. LEE |
| LEE & MORSE, P.C. |
| 3141 FAIRVIEW PARK DRIVE, SUITE 500 |
| FALLS CHURCH, VA 22042 |
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