Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2012
|
Application #:
|
13042733
|
Filing Dt:
|
03/08/2011
|
|
Inventors:
|
Chia-Hua CHU, Kuei-Sung Chang, Chung-Hsien LIN, Jung-Huei PENG, Chia-Ming HUNG et al
|
|
Title:
|
PACKAGE SYSTEMS HAVING A CONDUCTIVE ELEMENT THROUGH A SUBSTRATE THEREOF AND MANUFACTURING METHODS OF THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
|
|
|
|
| LOWE HAUPTMAN HAM & BERNER, LLP (TSMC) |
| 1700 DIAGONAL ROAD, SUITE 300 |
| ALEXANDRIA, VA 22314 |
|
|
Search Results as of:
05/30/2024 11:16 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
