Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2012
|
Application #:
|
13343422
|
Filing Dt:
|
01/04/2012
|
|
Publication #:
|
|
Pub Dt:
|
04/26/2012
| | | | |
|
Inventors:
|
James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe, Richard L. Rassel
|
|
Title:
|
BOND PAD FOR WAFER AND PACKAGE FOR CMOS IMAGER
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 23 LIME TREE BAY AVENUE |
| SUITE #4-210, GOVERNORS SQUARE |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1209 |
|
|
|
|
| ERIC KARICH |
| 20 CRESTVIEW |
| ALISO VIEJO, CA 92656 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 21 HUNG TO ROAD |
| RM F, 10/F, INFO TECH CENTRE |
| KWUN TONG, KOWLOON, HONG KONG |
|
|
|
|
| ERIC KARICH |
| 20 CRESTVIEW |
| ALISO VIEJO, CA 92656 |
|
|
Search Results as of:
06/20/2024 12:49 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
