Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/28/2012
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Application #:
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12783792
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Filing Dt:
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05/20/2010
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Publication #:
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Pub Dt:
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12/09/2010
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Inventors:
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Da-Jung Chen, Chi-Feng Huang, Yi-Tsung Chen, Huei-Ren You, Jeng-Jen Li
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Title:
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ELECTRONIC ELEMENT PACKAGING MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, R&D 2ND, SCIENCE-BASED INDUSTRIAL PARK |
| HSCINCHU, TAIWAN R.O.C. |
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| J. C. PATENTS |
| 4, VENTURE SUITE 250 |
| IRVINE, CA 92618 |
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