Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/11/2012
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Application #:
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12830754
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Filing Dt:
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07/06/2010
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Publication #:
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Pub Dt:
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01/13/2011
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Inventors:
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Qiang Tang, Ramin Ghodsi
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Title:
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LAYOUT FOR HIGH DENSITY CONDUCTIVE INTERCONNECTS
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Assignment:
1
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STATEMENT UNDER 37 CFR 3.37(B) & POWER OF ATTORNEY
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26 DEER CREEK LANE |
MOUNT KISCO, NEW YORK 10549 |
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RICHARD J. BOTOS |
LERNER, DAVID, LITTENBERG ET AL. |
600 SOUTH AVENUE WEST |
WESTFIELD, NJ 07090 |
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