Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/18/2012
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Application #:
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13004946
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Filing Dt:
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01/12/2011
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Publication #:
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Pub Dt:
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12/22/2011
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Inventors:
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David Wei WANG, An-Hong Liu, Yi-Chang Lee, Hsiang-Ming Huang, Jar-Dar Yang
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Title:
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MULTI-CHIP STACK PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.1, R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU CITY, TAIWAN |
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SINORICA, LLC |
2275 RESEARCH BLVD. |
SUITE 500 |
ROCKVILLE, MD 20850 |
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