Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/02/2012
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Application #:
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12602285
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Filing Dt:
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05/27/2010
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Publication #:
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Pub Dt:
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10/14/2010
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Inventors:
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Yong Won Cha, Dong Chul Kim
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Title:
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WAFER CLEANING METHOD AND WAFER BONDING METHOD USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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104-2, GAJANG-DONG, OSAN-SI |
GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 447-210 |
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ALSTON & BIRD LLP |
BANK OF AMERICA PLAZA |
101 SOUTH TRYON STREET, SUITE 4000 |
CHARLOTTE, NC 28280-4000 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE INVENTORSHIP OF THIS APPLICATION BY REMOVING INVENTORS - IN SUNG KIM; CHIEN YUN TAO; JEONG IL KANG PREVIOUSLY RECORDED ON REEL 024451 FRAME 0565. ASSIGNOR(S) HEREBY CONFIRMS THE INVENTORS YONG WON CHA AND DONG CHUL KIM ARE THE CORRECT INVENTORS FOR THIS APPLICATION.
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104-2, GAJANG-DONG, OSAN-SI |
GYEONGGI-DO, KOREA, REPUBLIC OF 447-210 |
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ALSTON & BIRD LLP |
BANK OF AMERICA PLAZA |
101 SOUTH TRYON STREET, SUITE 4000 |
CHARLOTTE, NC 28280-4000 |
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