Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/02/2012
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Application #:
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12707239
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Filing Dt:
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02/17/2010
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Publication #:
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Pub Dt:
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08/18/2011
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Inventors:
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Chiung C. Lo, Arkadii V. Samoilov, Reynante T. Alvarado
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Title:
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WAFER-LEVEL PACKAGED DEVICE HAVING SELF-ASSEMBLED RESILIENT LEADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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120 SAN GABRIEL DRIVE |
SUNNYVALE, CALIFORNIA 94086 |
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KEVIN E. WEST |
222 SOUTH 15TH STREET |
SUITE 240 |
OMAHA, NE 68102 |
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