Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/30/2012
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Application #:
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13146759
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Filing Dt:
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07/28/2011
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Publication #:
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Pub Dt:
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11/24/2011
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Inventors:
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Joerg Braeuer, Thomas Gessner, Lutz Hofmann, Joerg Froemel, Maik Wiemer, Holger Letsch et al
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Title:
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MICROSTRUCTURE WITH REACTIVE BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HANSASTR. 27C |
| MUENCHEN, GERMANY D-80686 |
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| STRASSE DER NATIONEN 62 |
| CHEMNITZ, GERMANY D-09111 |
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| LERNER GREENBERG STEMER LLP |
| 2445 HOLLYWOOD BLVD |
| HOLLYWOOD, FL 33020 |
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