Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
11/06/2012
|
Application #:
|
12270457
|
Filing Dt:
|
11/13/2008
|
Publication #:
|
|
Pub Dt:
|
05/13/2010
| | | | |
Inventors:
|
Byoung Hwa Lee, Min Cheol Park, Todd Harvey Hubing, Haixin Ke, Ho Cheol Kwak
|
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT CHIP, MULTILAYER CHIP CAPACITOR AND SEMICONDUCTOR INTEGRATED CIRCUIT CHIP PACKAGE
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
314 MAETAN3-DONG, YEONGTONG-GU, SUWON, |
GYUNGGI-DO, KOREA, REPUBLIC OF |
|
|
CLEMSON UNIVERSITY, 300 BRACKETT HALL, |
CLEMSON, SOUTH CAROLINA 29634 |
|
|
|
MCDERMOTT WILL & EMERY LLP |
600 13TH STREET, N.W. |
WASHINGTON, DC 20005-3096 |
|
|
Search Results as of:
09/22/2024 05:13 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|