Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/06/2012
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Application #:
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12794027
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Filing Dt:
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06/04/2010
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Publication #:
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Pub Dt:
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12/16/2010
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Inventors:
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Sang Gui Jo, Ji-Yong Park, Kwangjin Bae, Soyoung Lim
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Title:
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SEMICONDUCTOR PACKAGE HAVING SUBSTRATE WITH SOLDER BALL CONNECTIONS AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416 MAETAN-DONG, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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EUGENE M. LEE |
LEE & MORSE, P.C. |
3141 FAIRVIEW PARK DRIVE, SUITE 500 |
FALLS CHURCH, VIRGINIA 22042 |
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