Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/27/2012
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Application #:
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12470255
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Filing Dt:
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05/21/2009
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Publication #:
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Pub Dt:
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11/26/2009
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Inventors:
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Chia-Lun TSAI, Wen-Cheng CHIEN, Po-Han LEE, Wei-Ming CHEN
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Title:
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ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4F., NO. 25, JILIN RD., |
TAOYUAN COUNTY |
JHONGLI CITY, TAIWAN 320 |
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WEN LIU |
444 S. FLOWER STREET, SUITE 1750 |
LOS ANGELES, CA 90071 |
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