Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/25/2012
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Application #:
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12873068
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Filing Dt:
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08/31/2010
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Publication #:
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Pub Dt:
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03/01/2012
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Inventor:
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Kum Weng Loo
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Title:
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SEMICONDUCTOR PACKAGE WITH THERMAL HEAT SPREADER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5A SERANGOON NORTH AVENUE 5 |
| SINGAPORE, SINGAPORE 554574 |
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| HAYLEY J. STEVENS |
| 701 FIFTH AVENUE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DU CHAMP-DES-FILLES 39 |
| PLAN-LES-OUATES |
| GENEVA, SWITZERLAND 1228 |
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| RAJ K. KRISHNAN |
| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE, SUITE 300 |
| COPPELL, TX 75019 |
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