Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/01/2013
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Application #:
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11847101
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Filing Dt:
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08/29/2007
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Publication #:
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Pub Dt:
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03/05/2009
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Inventors:
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Neil Mclellan, Adam Zbrzezny
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Title:
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WAFER LEVEL PACKAGING OF SEMICONDUCTOR CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1 COMMERCE VALLEY DRIVE EAST |
MARKHAM, ONTARIO, CANADA L3T 7X6 |
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CHRISTOPHER J. RECKAMP |
222 N. LASALLE STREET |
VEDDER PRICE |
CHICAGO, IL 60601 |
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