Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/19/2013
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Application #:
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12466985
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Filing Dt:
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05/15/2009
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Publication #:
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Pub Dt:
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11/18/2010
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Inventors:
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CHIA HO SU, WEN SHENG LIN, CHENG CHIEH CHEN
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Title:
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APPARATUS FOR TESTING BONDING STRENGTH OF ELECTRICAL CONNECTIONS AND FRICTIONLESS CALIBRATION DEVICE FOR THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F-1, NO.38, TAIYUAN ST., JHUBEI CITY |
| HSINCHU COUNTY, TAIWAN 302 |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 2030 MAIN STREET, SUITE 1300 |
| IRVINE, CA 92614 |
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