Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/26/2013
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Application #:
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12981475
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Filing Dt:
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12/30/2010
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Publication #:
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Pub Dt:
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07/05/2012
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Inventors:
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Su-Tsai Lu, Jing-Ye Juang, Yu-Min Lin
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Title:
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WAFER LEVEL MOLDING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, |
HSINCHU, TAIWAN 31040 |
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
ROOSEVELT ROAD, SECTION 2 |
TAIPEI CITY, 100 TAIWAN |
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