Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/26/2013
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Application #:
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12457775
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Filing Dt:
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06/22/2009
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Publication #:
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Pub Dt:
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12/31/2009
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Inventors:
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So-Young Lim, Sang-Heui Lee
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Title:
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TEST PAD STRUCTURE, A PAD STRUCTURE FOR INSPECTING A SEMICONDUCTOR CHIP AND A WIRING SUBTRATE FOR A TAPE PACKAGE HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VIRGINIA 20195 |
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