Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/05/2013
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Application #:
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13463910
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Filing Dt:
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05/04/2012
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Inventors:
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Chung Sheung YUNG, Shing Lui LAU, Chi Ming CHONG, Gary Peter WIDDOWSON
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Title:
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APPARATUS FOR ALIGNING A BONDING TOOL OF A DIE BONDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768924 |
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SUGHRUE MION |
2100 PENNSYLVANIA AVE. |
WASHINGTON, DC 20037 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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2 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768924 |
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CPA GLOBAL |
CASTLE STREET , LIBERATION HOUSE |
ST HELIER, JERSEY, JE1 1BL JERSEY |
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