Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/19/2013
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Application #:
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12562950
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Filing Dt:
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09/18/2009
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Publication #:
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Pub Dt:
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11/18/2010
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Inventors:
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Bernd Karl APPELT, William T. CHEN, Calvin CHEUNG, Chia-Cheng CHEN, Ta-Chun LEE et al
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Title:
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SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER, AND PACKAGE APPLIED WITH THE SUBSTRATE , AND METHODS OF MANUFACTURING OF THE SUBSTRATE AND PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, JINGSAN RD. |
| NANTZ CHIU |
| KAOHSIUNG, TAIWAN 811 |
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| JOE MCKINNEY MUNCY |
| P.O. BOX 1364 |
| FAIRFAX, VA 22038 |
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