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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/02/2013
Application #:
13168107
Filing Dt:
06/24/2011
Publication #:
Pub Dt:
01/12/2012
Inventor:
Jin Ho BAE
Title:
SEMICONDUCTOR DEVICE AND PACKAGE
Assignment: 1
Reel/Frame:
026498/0307Recorded: 06/24/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/17/2011
Assignee:
SAN 136-1, AMI-RI, BUBAL-EUP
ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
WILLIAM PARK & ASSOCIATES LTD.
930 N. YORK ROAD, SUITE 201
HINSDALE, IL 60521

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