Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/16/2013
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Application #:
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13094216
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Filing Dt:
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04/26/2011
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Publication #:
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Pub Dt:
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12/29/2011
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Inventors:
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Jun-young Ko, Jae-yong Park, Heui-seog Kim, Ho-geon Song
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Title:
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METHOD OF MOLDING SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF |
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| MILLS & ONELLO LLP |
| ELEVEN BEACON STREET |
| SUITE 605 |
| BOSTON, MA 02108 |
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