Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/07/2013
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Application #:
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13107058
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Filing Dt:
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05/13/2011
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Publication #:
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Pub Dt:
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09/08/2011
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Inventor:
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Mou-Shiung Lin
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Title:
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CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ROOM 301/302, NO. 47, PARK 2ND RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN |
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MCDERMOTT WILL & EMERY LLP |
18191 VON KARMAN AVENUE |
SUITE 500 |
IRVINE, CA 92612-7108 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121 |
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QUALCOMM INCORPORATED |
5775 MOREHOUSE DRIVE |
SAN DIEGO, CA 92121-1714 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121 |
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QUALCOMM INCORPORATED |
5775 MOREHOUSE DRIVE |
SAN DIEGO, CA 92121 |
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