Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/14/2013
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Application #:
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13236421
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Filing Dt:
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09/19/2011
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Publication #:
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Pub Dt:
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03/21/2013
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Inventors:
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DONALD E. COOPER, William E. Tennant
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Title:
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HYBRID CIRCUIT STRUCTURE AND PARTIAL BACKFILL METHOD FOR IMPROVING THERMAL CYCLING RELIABILITY OF SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1049 CAMINO DOS RIOS |
| THOUSAND OAKS, CALIFORNIA 91360 |
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| KOPPEL, PATRICK, HEYBL & PHILPOTT, PLC |
| 2815 TOWNSGATE ROAD |
| SUITE 215 |
| WESTLAKE VILLAGE, CA 91361-5827 |
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