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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
8456017
Issue Dt:
06/04/2013
Application #:
13174794
Filing Dt:
07/01/2011
Publication #:
20120273939
Pub Dt:
11/01/2012
Inventors:
Ming-Ji Dai, Heng-Chieh Chien, Ming-Che Hsieh, Jui-Feng Hung, Ra-Min Tain, John H. Lau
Title:
FILLED THROUGH-SILICON VIA WITH CONDUCTIVE COMPOSITE MATERIAL
Assignment: 1
Reel/Frame:
026546/0372Recorded: 07/06/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
DAI, MING-JI
Exec Dt:
06/03/2011
CHIEN, HENG-CHIEH
Exec Dt:
06/03/2011
HSIEH, MING-CHE
Exec Dt:
06/13/2011
HUNG, JUI-FENG
Exec Dt:
06/14/2011
TAIN, RA-MIN
Exec Dt:
06/14/2011
LAU, JOHN H.
Exec Dt:
06/14/2011
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG,
HSINCHU, TAIWAN 31040
Correspondent:
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
TAIPEI, 100 TAIWAN

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