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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8481343
Issue Dt:
07/09/2013
Application #:
12961521
Filing Dt:
12/07/2010
Publication #:
20120068288
Pub Dt:
03/22/2012
Inventors:
Chung-Hsien Hsin, Hsiu-Wen Tu, Chin-Fu Lin, Young-Houng Shiao, Chun-Hua Chuang et al
Title:
MANUFACTURING METHOD OF MOLDED IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH AND THE STRUCTURE USING THE SAME
Assignment: 1
Reel/Frame:
025458/0861Recorded: 12/07/2010Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HSIN, CHUNG-HSIEN
Exec Dt:
10/05/2010
TU, HSIU-WEN
Exec Dt:
10/05/2010
CHUANG, CHUN-HUA
Exec Dt:
10/05/2010
KUO, REN-LONG
Exec Dt:
10/05/2010
LIN, CHIN-FU
Exec Dt:
10/05/2010
SHIAO, YOUNG-HOUNG
Exec Dt:
10/05/2010
Assignee:
KINGPAK TECHNOLOGY INC.
NO. 84, TAI-HO RD., CHU-PEI 302
CHU-PEI CITY, HSIN-CHU HSIEN, TAIWAN 302
Correspondent:
JUAN CARLOS A. MARQUEZ
1199 N. FAIRFAX STREET, SUITE 900
STITES & HARBISON PLLC
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
062119/0661Recorded: 12/14/2022Pages: 13
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
KINGPAK TECHNOLOGY INC.
Exec Dt:
08/26/2022
Assignee:
TONG HSING ELECTRONIC INDUSTRIES, LTD.
6F., NO. 83, YANPING S. RD., ZHONGZHENG DIST.
TAIPEI CITY, TAIWAN 100011
Correspondent:
MCCLURE, QUALEY & RODACK LLP
280 INTERSTATE NORTH CIRCLE
SUITE 550
ATLANTA, GA 30339

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