Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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13254905
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Filing Dt:
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11/04/2011
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Publication #:
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Pub Dt:
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03/01/2012
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Inventors:
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John McMillan, Serafin P. Pedron Jr., Kirk Powell, Adonis Fung
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Title:
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LEADLESS ARRAY PLASTIC PACKAGE WITH VARIOUS IC PACKAGING CONFIGURATIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| UNIT E, 9TH FLOOR |
| METEX HOUSE, 28 FUI YIU KOK STREET |
| TSUEN WAN, NEW TERRITORIES HONG KONG, CHINA |
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| STANLEY R. MOORE |
| WINSTEAD PC |
| P.O. BOX 50784 |
| DALLAS, TX 75201 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE ADD ANNEX INADVERTENTLY LEFT OUT ORIGINAL ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 037880 FRAME: 0534. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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