Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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13262293
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Filing Dt:
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09/30/2011
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Publication #:
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Pub Dt:
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02/09/2012
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Inventors:
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Se Hoon Yoo, Chang Woo Lee, Jun Ki Kim, Jeong Han Kim, Cheol Hee Kim, Young Ki Ko et al
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Title:
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DEVICE OF FILLING METAL IN THROUGH-VIA-HOLE OF SEMICONDUCTOR WAFER AND METHOD USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 35-3 HONGCHEON-RI, IPJANG-MYUN, SEOBUK-GU |
| CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 331-825 |
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| SHERR & VAUGHN, PLLC |
| 620 HERNDON PARKWAY |
| SUITE 320 |
| HERNDON, VA 20170 |
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