Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/23/2013
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Application #:
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13029125
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Filing Dt:
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02/17/2011
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Publication #:
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Pub Dt:
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02/02/2012
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Inventor:
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SHEN-BO LIN
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Title:
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LED PACKAGE WITH BOUNDING DAM SURROUNDING LED CHIP AND THERMOSET ENCAPSULATION ENCLOSING LED CHIP AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 13, GONGYE 5TH RD., HSINCHU INDUSTRIAL PARK,HUKOU SHIANG |
| HSINCHU HSIEN 303, TAIWAN |
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| RAYMOND J. CHEW |
| 288 SOUTH MAYO AVENUE |
| CITY OF INDUSTRY, CA 91789 |
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