Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/30/2013
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Application #:
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13520284
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Filing Dt:
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07/02/2012
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Publication #:
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Pub Dt:
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01/24/2013
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Inventors:
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Kyoung-Min Kim, Jung-Hyun Kim
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Title:
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PACKAGE MODULE STRUCTURE FOR HIGH POWER DEVICE WITH METAL SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2305 SEMICONDUCTOR-DONG |
| KAIST GUSEONG-DONG |
| YUSEONG-GU, DAEJEON, KOREA, REPUBLIC OF 305-338 |
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| MAYER & WILLIAMS PC |
| 251 NORTH AVENUE WEST |
| SUITE 201 |
| WESTFIELD, NJ 07090 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12, WONGOMAE-RO, GIHEUNG-GU, YONGIN-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 135-010 |
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| 2305, SEMICONDUCTOR-DONG,KAIST GUSEONG-DONG, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 305-38 |
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| MAYER & WILLIAMS PC |
| 251 NORTH AVENUE WEST |
| WESTFIELD, NJ 07090 |
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