Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/06/2013
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Application #:
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12616652
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Filing Dt:
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11/11/2009
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Publication #:
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Pub Dt:
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02/03/2011
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Inventors:
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Uway Tseng, Lin-June Wu, Yu-Ting Lin
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Title:
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CMOS IMAGE SENSOR BIG VIA BONDING PAD APPLICATION FOR ALCU PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN ROAD 6 |
HSIN-CHU, TAIWAN 300-77 |
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HAYNES AND BOONE, LLP |
2323 VICTORY AVENUE |
SUITE 700 |
DALLAS, TX 75219 |
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