Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/13/2013
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Application #:
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12117264
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Filing Dt:
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05/08/2008
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Inventors:
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Steven S. NASIRI, Goksen G. YARALIOGLU
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Title:
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WAFER SCALE CHIP SCALE PACKAGING OF VERTICALLY INTEGRATED MEMS SENSORS WITH ELECTRONICS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1197 BORREGAS AVENUE |
| SUNNYVALE, CALIFORNIA 94089 |
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| JOSEPH A. SAWYER, JR. |
| 2465 EAST BAYSHORE ROAD, #406 |
| PALO ALTO, CA 94303 |
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