Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/20/2013
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Application #:
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12785205
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Filing Dt:
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05/21/2010
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Inventors:
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Thomas A. Ponnuswamy, John H. Sukamto, Jonathan D. Reid, Steven T. Mayer
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Title:
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COPPER ELECTROPLATING PROCESS FOR UNIFORM ACROSS WAFER DEPOSITION AND VOID FREE FILLING ON SEMI-NOBLE METAL COATED WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3970 NORTH FIRST STREET |
SAN JOSE, CALIFORNIA 95134 |
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WEAVER AUSTIN VILLENEUVE & SAMPSON LLP |
P.O. BOX 70250 |
OAKLAND, CA 94612-0250 |
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