Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/20/2013
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Application #:
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13173226
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Filing Dt:
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06/30/2011
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Publication #:
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Pub Dt:
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02/02/2012
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Inventors:
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Naohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI
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Title:
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FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE CONTAINING THERMOCONDUCTIVE FILLER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-2, SHIMOHOZUMI 1-CHOME |
IBARAKI-SHI, OSAKA, JAPAN |
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SUGHRUE-265550 |
2100 PENNSYLVANIA AVE. NW |
WASHINGTON, DC 20037-3213 |
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