Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/20/2013
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Application #:
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12691722
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Filing Dt:
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01/21/2010
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Publication #:
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Pub Dt:
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07/29/2010
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Inventor:
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Wen-Chieh Tsou
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Title:
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PACKAGE SUBSTRATE STRUCTURE AND CHIP PACKAGE STRUCTURE AND MANUFACTURING PROCESS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.25, LANE 76, SEC.3, CHUNG YANG ROAD. |
| TUCHENG |
| TAIPEI, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F-1, NO.100, ROOSEVELT RD., SEC.2 |
| TAIPEI, 100 TAIWAN |
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