Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/27/2013
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Application #:
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13112253
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Filing Dt:
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05/20/2011
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Publication #:
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Pub Dt:
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09/06/2012
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Inventors:
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Huei-Nuan Huang, Pin-Cheng Huang, Chun-Hung Lu, Chun-Chieh Chao, Chi-Hsin Chiu
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Title:
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INNER-LAYER HEAT-DISSIPATING BOARD, MULTI-CHIP STACK PACKAGE STRUCTURE HAVING THE INNER LAYER HEAT-DISSIPATING BOARD AND FABRICATION METHOD THEREOF
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
TAICHUNG, TAIWAN |
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EDWARDS ANGELL PALMER & DODGE LLP |
P.O. BOX 55874 |
BOSTON, MA 02205 |
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