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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/27/2013
Application #:
13222130
Filing Dt:
08/31/2011
Publication #:
Pub Dt:
05/03/2012
Inventors:
Laung-Terng Wang, Nur Touba, Michael S. Hsiao, Zhigang Jiang, Shianling Wu
Title:
METHOD AND APPARATUS FOR TESTING 3D INTEGRATED CIRCUITS
Assignment: 1
Reel/Frame:
026835/0315Recorded: 08/31/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/29/2011
Exec Dt:
08/30/2011
Exec Dt:
08/30/2011
Exec Dt:
08/29/2011
Exec Dt:
08/30/2011
Assignee:
505 S. PASTORIA AVENUE, SUITE 101
SUNNYVALE,, CALIFORNIA 94086-7583
Correspondent:
BACON & THOMAS, PLLC
625 SLATERS LANE, 4TH FL
ALEXANDRIA, VA 22314

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