Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/15/2013
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Application #:
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12926137
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Filing Dt:
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10/27/2010
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Publication #:
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Pub Dt:
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04/28/2011
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Inventors:
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Ey Yong Kim, Young Hwan Shin, Soon Jin Cho, Jong Yong Kim, Jin Seok Lee
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Title:
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FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314 MAETAN-3-DONG, YEONGTONG-GU |
SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF |
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STAAS & HALSEY LLP |
ATTENTION: SANG CHUL KWON |
1201 NEW YORK AVE., N.W., 7TH FLOOR |
WASHINGTON, D.C. 20005 |
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