Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/22/2013
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Application #:
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12385087
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Filing Dt:
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03/30/2009
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Publication #:
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Pub Dt:
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10/01/2009
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Inventors:
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Friedrich Severin Buehler, Etienne Aepli, Ralf Hala, Sepp Bass
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Title:
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Polyamide moulding compound for varnish-free, tough casings with a high-gloss surface
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| REICHENAUERSTRASSE |
| DOMAT/EMS, SWITZERLAND 7013 |
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| JACOBSON HOLMAN PLLC |
| 400 SEVENTH STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20004 |
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