Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/29/2013
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Application #:
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13111982
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Filing Dt:
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05/20/2011
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Publication #:
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Pub Dt:
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06/14/2012
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Inventors:
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John Robert MCMILLAN, Xiao Yun CHEN, Tung Lok LI
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Title:
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PRE-BONDED SUBSTRATE FOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8/F, HALE WEAL INDUSTRIAL BUILDING, 22-28 TAI CHUNG ROAD, |
| TSUEN WAN, N.T., HONG KONG, HONG KONG |
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| EAGLE IP LIMITED |
| 13/F, BRIGHT WAY TOWER |
| 33 MONG KOK ROAD |
| KOWLOON, HONG KONG |
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