Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/19/2013
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Application #:
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13670438
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Filing Dt:
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11/06/2012
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Publication #:
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Pub Dt:
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06/20/2013
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Inventors:
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Po-Jen Su, Chih-Ling Wu, Yi-Ru Huang, Yi-Ju Shih
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.5 DALI 3RD RD., TAINAN SCIENCE-BASED INDUSTRIAL PARK, |
| TAINAN CITY, TAIWAN 74144 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 31, SEC. 2, HUANDONG RD., SHANHUA DIST., |
| TAINAN CITY, TAIWAN 741014 |
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| 22F., NO.392, RUEY KUANG RD., NEIHU, |
| TAIPEI, TAIWAN 11492 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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