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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8587943
Issue Dt:
11/19/2013
Application #:
13305092
Filing Dt:
11/28/2011
Publication #:
20130135812
Pub Dt:
05/30/2013
Inventors:
Vinod Kamath, Derek I. Schmidt, James S. Womble, Richard M. Barina, Chunjian Ni et al
Title:
LIQUID-COOLING MEMORY MODULES WITH LIQUID FLOW PIPES BETWEEN MEMORY MODULE SOCKETS
Assignment: 1
Reel/Frame:
027312/0757Recorded: 12/01/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BARINA, RICHARD M.
Exec Dt:
11/08/2011
KAMATH, VINOD
Exec Dt:
11/08/2011
NI, CHUNJIAN
Exec Dt:
11/08/2011
SCHMIDT, DEREK I.
Exec Dt:
11/08/2011
STEINKE, MARK E.
Exec Dt:
11/08/2011
WOMBLE, JAMES S.
Exec Dt:
11/08/2011
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
JEFFREY STREETS
13100 WORTHAM CENTER DR.
SUITE 245
HOUSTON, TX 77065
Assignment: 2
Reel/Frame:
034194/0291Recorded: 11/10/2014Pages: 38
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INTERNATIONAL BUSINESS MACHINES CORPORATION
Exec Dt:
09/26/2014
Assignee:
LENOVO INTERNATIONAL LIMITED
979 KING'S ROAD
23/F LINCOLN HOUSE, TAIKOO PLACE
QUARRY BAY, HONG KONG
Correspondent:
OBLON, SPIVAK, ET AL.
1940 DUKE STREET
ALEXANDRIA, VA 22314

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